Abstract
This chapter provides a historical perspective of solder joint inspection and its present role in the establishment of manufacturing techniques, processes, and controls that produce very highly reliable electronic assemblies. The scope of this chapter is limited to solder joint inspection and, therefore, does not address electrical testing technologies. The criteria necessary for evaluating the reliability of currently produced solder joints are presented and compared with the data necessary for compliance with modern specifications. A review of potential inspection technologies and methods is provided, along with sample inspection data acquired from Rensselaer Polytechnic Institute’s effort in the Air Force’s MANTECH for Advanced Data/Signal Processing program. A discussion of automation of the inspection process includes an example of a novel technique that was developed to reduce the amount of effort and set-up time necessary to acquire inspection data using x-ray equipment. An assessment of automatic defect detection capabilities of various inspection technologies is provided to indicate how the inspection data can be used to detect manufacturing defects and aid in process control. Considerations of the future requirements for inspection conclude with an illustration of how inspection data can be further used to produce a non-destructive 3-D visualization of the solder joint, which can then be used to aid in the prediction of a design’s reliability.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
