Reliability Prediction Platform of SiC Half Bridge Power Module

Abstract

This study aims to establish a technique for predicting the lifetime of SiC power modules; therefore, commercial SiC power modules are utilized to conduct parametric tests of power cycle test (PCT) under varied junction temperature swings (T <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">j</inf> ). The test findings indicate that the PCT reliability data is extremely steady, whereas the failure analysis reveals delamination and fissures within the solder layer. This is consistent with the increase in junction-to-case thermal resistance (R <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th.j-c</inf> ) of the module during PCT. Using finite element analysis (FEA) to investigate the physical cause of solder layer failure, the Coffin-Manson lifespan model is also established. Finally, the 1700V/100A SiC power module developed by ITRI is used to verify the high accuracy of the lifetime predication model.