Abstract
The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.
Highlights
Academic Editor: Ion StiharuShock is one of the most common challenges that MEMS needs to deal with in harsh environments [1]
Srikar proposed that the of the MEMS structure under shock loads can be divided into three modes, as shown in response of the MEMS structure under shock loads can be divided into three modes, as Figure elastic wave mode, resonance mode,mode, and quasi-static mode, according to the shown in 3: Figure
They proposed the concept of the valid region for the driving voltage, which could be a quantitative reference for the reliability of electrostatically driven comb structures under shock loads
Summary
Shock is one of the most common challenges that MEMS needs to deal with in harsh environments [1]. Micromachines 2021, 12, 1275 of structural dynamics, fracture mechanics, system reliability theory, and other fields [6,7,8,9,10] Topics, such as the material properties at the micrometer/nanometer scale, the dynamic response of the microstructure, and the impact damage of the structure, are themselves the frontier research subjects in their respective fields. These all make the in-depth study of MEMS reliability in shock environments extremely challenging. The seventh part focuses on the effect of coupling between shock loads and other physical factors
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