Abstract
This paper presents the reliability of a plastic land grid array (LGA) with 1156 pads, 1.0-mm pitch, and the reliability of a flip-chip ball grid array (FCBGA) with 1924 balls, 1-mm pitch, assembled with tin-lead solder onto printed circuit boards (PCBs). Surface finishes for PCBs were electroless nickel electroless palladium immersion gold (ENEPIG) and tin-lead hot air solder level (HASL). The LGA assemblies were first subjected to 200 thermal cycles (−55°C to 125°C) and then to 324 hours of aging at +125°C. The FCBGA assemblies were subjected to 200 thermal shock cycles (TS) in the range of −65°C to +150°C. Test results presented include daisy-chain resistances, SEM/X-section images, and dye and pry destructive failure analyses for HASL and ENEPIG surface finishes.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
