Abstract
Abstract Thick aluminum (Al) wedge bonds have been widely used in analog microelectronic packages due their lower cost, ease of use and excellent thermal and electrical performance. Reliability of thick Al wedge bonds on bare copper (Cu) leadframes under high temperature aging conditions has not been studied at a fundamental level in the past. This study investigates the reliability performance of Al wedge bonds on bare Cu surfaces under isothermal aging conditions specified by the automotive grade product qualification requirements. Results obtained show that Al/Cu intermetallic formed at the interface is detrimental to the mechanical and electrical package reliability. Plating on the leadframe has been evaluated as a potential mitigation to prevent intermetallic growth and hence improve the overall wedge bond and package reliability under high temperature reliability testing conditions. Significant improvement in the wedge bond and package reliability was achieved by using nickel plating under the wedge bonds. The results presented in this study can be used to design a more robust package capable of meeting stringent automotive grade requirements.
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