Reliability of Electronic Components with Special Reference to High Temperature and High Humidity

Abstract

Reliability aspect of electronic components has assumed great importance. The two main factors responsible for the greater stress on component reliability are: higher component densities in modern electronic appliances and the widely varying environmental conditions encountered during the useful “life”. This paper outlines the effect of various climatic conditions, especially in relation to high temperature and high humidity on component reliability.Theoretical aspects of computing reliability factor for components using well known distribution such as the “Exponential” and “Weibull” are mentioned. In order to take care of sampling variations in predicting population reliability parameters, confidence interval estimations by the use of the “Poisson” distribution are included in this paper.Laboratory investigations on reliability of components at the components factory of Philips India Ltd., Loni are outlined. Test conditions are necessarily severe in order to “compress” the time span in order to obtain quicker information. Data analysis and estimation techniques using statistical and graphical methods including the “Weibull” plot are described. Reliability information regarding some components made by Philips, Loni, is presented as illustration.