Abstract
Solid Diffusion Bonding of the Copper-Zinc system is preliminarily investigated as a possible bonding solution for power modules. The idea behind the study is to use standard processing equipment, as it is employed for instance for Silver sintering. The investigation is carried out on test vehicles consisting in a stack of Copper platelets and Zinc foils. After Solid Diffusion Bonding under different pressure and temperature conditions, the samples are submitted to thermal storage. Analysis is performed by non-destructive and destructive techniques. Particular attention has been paid to the time-dependency of the shear-strength of the bond as a function of the processing temperature.
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