Abstract
As part of the portable product interconnects characterisation programme, the present investigation was conducted to determine the attachment integrity and long‐term reliability of Thin small Outline package (TSOP) solder joints. Accelerated thermal cycling combined with analytical modelling was used to evaluate the reliability for credit card sized DRAM memory cards. The measured solder joint fatigue lifetimes varied from 645 to 830 thermal cycles for TSOP‐II and I components, respectively. The modelling results corroborated the empirical findings. The solder joint thermal fatigue data were used to predict the card reliability under operating field conditions. The cards were found to be reliable for their intended use environment.
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