Abstract
The thermal stresses induced by difference in Coefficient of Thermal Expansion between FR-4 board and 63Sn-37Pb solder joint directly affect the reliability of 63Sn-37Pb solder joint. This research, thus, focuses to investigate the crack initiation and propagation behaviour around solder joint by imposing a designed Accelerated Life Tests Procedure on solder joint by using a newly manufactured Thermal Impact Experimental Apparatus. The fracture mechanism of the solder joint was found to be highly influenced by thermal stresses. Fig. 1 illustrates a solder joint assembly deformed under thermal cycling. Arrows in Fig. 1 show thermal stresses induced around a solder joint under thermal cycling. And solder joint is deformed by thermal stresses.. ΔL is the deformation of solder joint by thermal stresses.
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