Reliability and micro-structural properties of GaAs Schottky diodes for submillimeter-wave applications : A. Grub, V. Krozer, A. Simon and H. L. Hartnagel. Solid-State Electronics, 37, 12, 1925 (1994)

Abstract

Abstract Whisker contacted GaAs Schottky barrier diodes are the standard devices for mixing and multiplier applications in the THz frequency range. This is mainly due to their minimum parasitics and mature technology. But with the decreasing size of the anode contact, which is required for operation at high frequencies (up to approx. 3 THz), the reliability and the micro-structural understanding of the Schottky barrier becomes increasingly important. This contribution presents new results concerning the reliability of Schottky diodes and the physical properties of small-area Schottky junctions, especially at low current densities. For these purposes a number of different Schottky diodes have been fabricated with different epilayer doping concentrations and anode diameters. Measured I / V characteristics show that the diode current deviates considerably from the ideal thermionic current behavior with decreasing diode diameter. This deviation shows an exponential dependence on the diode voltage and is a function of the doping concentration of the active layer. For a given doping concentration in the epi-layer and decreasing anode diameter, this phenomenon shifts the minimum of the ideality factor towards higher current densities. An explanation is given in terms of a difference of the cyrstallinity of the polycrystalline platinum films on the GaAs for decreasing SiO 2 aperture size in connection with a reduced Pt mobility in the electrolyte. The reliability of Schottky barrier diodes under thermal and electrical stress has been investigated on different THz Schottky diode structures. The results show that the barrier height and the ideality factor of the fabricated structures are not affected by thermal stress. Electrical stress induced by large forward currents up to a current density of 10 kA/mm 2 even leads to a slight increase of the barrier height and a reduction of the series resistance.