Abstract
Modular Multilevel Converter (MMC) valves are widely used in high-voltage direct current (HVDC) power transmission projects, and their reliability is one of the research priorities which is closely related to IGBT. Excessive junction temperature is one of the important causes of IGBT damage. Therefore, it is necessary to further study the key factors affecting IGBT junction temperature. Firstly, based on the temperature-sensitive parameter method, the thermal impedance model of IGBT is established, and the parameters of thermal impedance model under different working conditions are analyzed. Secondly, based on the numerical calculation model, the losses of the core component IGBT module of the converter valve under different working conditions are calculated. Then, the junction temperature of the IGBT is calculated by the thermal network method. Finally, the junction temperature of IGBT in the actual engineering of the MMC converter valve is calculated theoretically, the loss and junction temperature under different working conditions are analyzed.
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