Abstract
Analyzing the structural reliability of 3D heterogeneous microsystem modules is an important step in their development. The finite element models of such modules are simplified by simulating the complicated structure of MEMS (microelectromechanical systems) devices integrated into a single interposer. In this study, thermal stress and cycling analyses for different finite element models of 3D heterogeneous microsystem modules are investigated. The results of the thermal stress analysis reveal the values of the maximum von Mises stress in the finite element models, at the interface between the interposer and the microgyroscope, and in the microgyroscope spring. They also illustrate the advantages and disadvantages of the different fabrication models. Module reliability assessments are also obtained through a thermal cycling analysis, the results of which show that properly simplified models designed to reduce computation time benefit the reliability analysis. This study provides useful suggestions for manufacturing and reliability assessments of 3D heterogeneous microsystem modules embedded using the through-silicon via technique.
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