Relaxation of asymmetric crystallographic tilt: In situ x-ray diffraction studies of epitaxial electrodeposition of bismuth on GaAs (110)

Abstract

High quality, epitaxial thin-films are key components of almost all modern electronic devices. During deposition, lattice mismatch between the substrate and the film generates elastic strain. The strain energy grows with film thickness until a defect is generated that relieves the strain. The strain relaxation mechanism is critical in epitaxial electrodeposition. Here, we study how a metal (bismuth) film growing via electrodeposition on a semiconductor substrate [GaAs(110)] relaxes the lattice mismatch-induced strain. Using in situ synchrotron-based X-ray techniques, we monitor the crystallographic orientation and grain size of the growing film during electrochemical deposition. We (1) confirm that a single crystallographic orientation of the film, with (011¯8) as the oriented plane, can be selected by controlling the overpotential, η, and (2) find that, after a threshold thickness is reached, the tilt angle varies monotonically with film thickness. Our data are consistent with the film relaxing the strain by forming low-energy, asymmetric tilt boundaries.