Abstract
This paper investigates the relative stability between nucleate and film boiling modes of FC-72 and HFE-7100, which have potential to electronic device cooling applications. Equilibrium heat flux, qc, which refers to as an index for measuring the relative stability of boiling, was obtained at a liquid subcooling of 0-20 K. Experimental results reveal that (1) qcincreases with liquid subcooling; (2) although the FC-72 exhibits a higher critical heat flux (CHF) than does the HFE-7100, somewhat unexpectedly, the equilibrium heat flux for the latter is greater than the former. Restated, at a prescribed heat flux, the risk to burnout for boiling of FC-72 is higher than that of HFE-7100. The shift in boiling curves interprets the experimental findings.
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