Abstract
As integrated circuit technology advancements are pushing data rates to 6 Gb/s and beyond, channel simulations are becoming a necessity. As part of the topology modeling and simulation, the correct value of permittivity surrounding a printed circuit board (PCB) via hole structure is required for better accuracy. This paper presents data to suggest the relative permittivity of the dielectric surrounding a PCB via hole structure in the z-axis direction of a fiberglass reinforced PCB laminate is different from the relative permittivity surrounding a trace etch in the x/y-axis direction of the same PCB.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.