Abstract

Wideband permittivity and loss tangent curves for the dielectric laminate of a printed circuit board are obtained. For this purpose, the single-frequency data provided by the laminate manufacturer together with propagation constant experimentally obtained from stripline measurements are used. This allows for enabling the wideband simulation of interconnects while the dielectric material properties are defined respecting causality. Furthermore, using the extracted data, the dielectric and conductor effects on the signal attenuation and delay can be separated to analyze the corresponding impact on the propagation features of interconnects. This is demonstrated here through the implementation of an <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">RLGC</i> model up to 30 GHz.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call