Abstract

For fine pattern microelectronic circuits, there is a significant correlation between the aluminum corrosion and the dimensions of the electrode. Electrolytic leakage currents and aluminum corrosion have been studied using different combinations of width and spacing, (width/spacing) and , under temperature‐humidity‐bias test at 85°–140°C, 85%RH, and 0–150V. It was confirmed that electrolytic leakage currents and changes in the resistance of metal lines that constitute the pattern can be utilized to follow the aluminum corrosion. Activation energy values obtained from accelerated tests were 0.8 eV for electrolytic leakage current and 0.9 eV for aluminum corrosion. Also, it was determined that activation energy of aluminum corrosion was not affected by applied voltage. A paradoxical phenomenon was observed in that the corrosion resistance of the pattern was greater than that of the μm pattern when under an applied bias during exposure to the temperature‐humidity environment. This phenomenon can be explained by crack formation in the passivation layer induced by aluminum corrosion.

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