Relationship between curing activation energy and free formaldehyde content in urea-formaldehyde resins

Abstract

This study investigated the effect on the curing behavior, activation energy (E a) of the curing reaction, crystalline structure, crosslinking, and free formaldehyde content of the addition of the following scavengers in urea-formaldehyde (UF) resins: medium density fiber board flour, rice husk flour, silica powder, and tannin powder. The scavenger content was 3 and 7 wt% of the UF resin solid content. The curing behavior of UF resins was monitored by differential scanning calorimetry, thermogravimetric analysis, and X-ray crystallography. The curing E a was correlated to the free formaldehyde content of the scavenger containing UF resins. The thermal stability of the UF resins increased but the curing E a decreased with increasing scavenger content. After curing, the crystallinity of the UF resins decreased in the presence of scavengers. The unreacted free formaldehyde content was reduced in the tannin powder containing UF resins. The degree of crosslinking affects the formaldehyde emission from wood panels bonded with UF resin. This is especially true for wood panels in service for long periods of time and exposed to high humidity conditions. Once the free formaldehyde which influences considerably the emission has disappeared, the presence of the –CH2– groups then becomes important. Hence, an increased resin crosslinking indicates a higher concentration of –CH2– groups present, which may hydrolyze and emit formaldehyde slowly over time.