Reinforced copper matrix composites with highly dispersed nano size TiC in-situ generated from the Carbon Polymer Dots

Abstract

In order to uniformly disperse the ceramic reinforcements synthesized in situ in the copper matrix composites, this study used Carbon Polymer Dot (CPD) as the carbon source and Cu-1.0%Ti alloy powder as the matrix to supply the Ti source for manufacturing in situ synthesized TiC/Cu composites. The results showed that TiC nano-precipitate formed in the grains interior and grain boundaries, with particle sizes that were similar to the CPD size and maintained a uniform distribution state. Compared with the matrix, 0.3 wt% CPD/Cu composite displayed the best strength-plastic compatibility, the UTS had achieved to be 385 MPa accompanied with a corresponding EL of 21%. This was owing to the dislocation hindrance caused by nano-carbide and excellent interface bonding between nano TiC and the Cu matrix. The density function theory calculation had supported our experimental results, which showed a tighter and stronger interface contact. This paper presents a new approach for studying in situ carbide precipitates. To create the in situ synthesized nano-sized TiC/Cu composites, Carbon Polymer Dot (CPD) was used as the carbon source. Theoretical and experimental findings support the strong interfacial bonding between TiC and copper matrix. The proposed method of in-situ synthesized nano-scaled TiC demonstrates to be a novel way to construct high-performance Cu matrix composites with both enhanced strength and plasticity.