Regulation of multidimensional silver nanostructures for high-performance composite conductive adhesives

Abstract

Electrically conductive adhesives (ECAs) are widely used in electronics and silver-based ECA is one of the most typical representatives. In this work, a trinary silver-based filler strategy was proposed to achieve ECAs with high conductivity and low silver content, where silver fractal flowers (Ag-FWs) were used to set up the conductive framework and silver nanowires (Ag-NWs) and silver nanoflakes (Ag-NFs) were added to connect the separated domains and fill the small gaps, respectively. The ECAs reached a low electrical resistivity of 6.0 × 10−5 Ω cm and high adhesion strength of 13.5 MPa when the addition of Ag-FWs, Ag-NWs and Ag-NFs were 50 wt%, 7.5 wt% and 2.5 wt%, respectively, superior to those reported ECAs of 80 wt% silver loading. Besides, the ECA circuit fabricated by 3D printer demonstrated good electrical conductivity and resistance stability. The preparation idea of ECAs brings novel opportunities for the development of the electronic packaging industries.