Abstract
AbstractArgon plasma‐pretreated polyimide (PI) films were subjected to UV‐induced surface graft copolymerization with 4‐vinylpyridine(4VP) under atmospheric conditions. Electroless plating of silver was carried out effectively on the 4VP graft copolymerized PI (PI‐g‐P4VP) surface after PdCl2 activation and in the absence of SnCl2 sensitization (the Sn‐free process). The surface compositions of the modified PI films were studied by X‐ray photoelectron spectroscopy (XPS). XPS results showed that the PI‐g‐P4VP surface is ready for electroless deposition of silver via the Sn‐free process. The grafted 4VP layer with well‐preserved pyridine groups was used not only as the chemisorption sites for the palladium complexes (without the need for prior sensitization by SnCl2) during the electroless plating of silver, but also as an adhesion promotion layer for the electrolessly deposited silver. The silver metallized PI films show high reflectivity and conductivity with a surface resistance of 1.5 Ω and a reflectivity of 91.3%, respectively. Copyright © 2007 John Wiley & Sons, Ltd.
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