Abstract
The contact resistance at conducting polymer-electrode junctions could substantially affect device performance because electrical currents or signals generated in the polymer devices must be transferred in their final form through the junctions to the connected load or devices. We report here the specific contact resistance between the conducting polymer poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) and a metal electrode as measured by a transmission line technique. Toward developing printed electronics that do not require vacuum processes, we focus on the specific contact-resistance, rc, between PEDOT:PSS films and metal pastes. Addition of a second solvent such as ethylene glycol (EG), poly-ethylene glycol (PEG), and dimethyl sulfoxide (DMSO) to PEDOT:PSS solution for film formation induced a significant reduction of rc together with an enhancement of electrical conductivity. A surface treatment using EG or DMSO on electrode areas of the film also decreased rc at the PEDOT:PSS-Ag paste junction to the value at the PEDOT:PSS-Ag junction formed by electron-beam evaporation. The mechanism of reduction of rc is discussed based on morphology of the PEDOT:PSS film.
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