Abstract
A reduction of post-weld shift (PWS) in semiconductor laser packaging using a laser welding technique is presented. It is found that the PWS and its association with the power coupling loss of the laser packaging can be reduced under proper pressure constraint. Characteristics of defect mechanisms in laser welding techniques for semiconductor laser packaging are also investigated experimentally. The results in the stainless-to-Kovar joints show that the surface cracks are dependent on the Au thickness on the Kovar material. The low solubility of gold in the Kovar is identified as the defect mechanism for surface cracks. Preliminary reliability data demonstrated that these laser packages without crack defects in the welded joints are reliable.
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