Abstract
Future integrated circuits require shallow pn junctions with a depth below 50 nm and, therefore, low energy ion beams are necessary. Cluster ions can realize both goals of low-energy and high-current ion beams quite easily, because the kinetic energy of a cluster is shared among constituent atoms. Another advantage of cluster ion implantation is that the substrate damage induced by ion bombardment can be controlled by changing the cluster size. As a consequence, the transient enhanced diffusion (TED) of the dopant during annealing can be controlled in cluster ion implantation. We have used the polyatomic cluster, decaborane (B 10H 14) to form very shallow p + junctions. During 900 °C annealing, the diffusion of boron atoms implanted at 3 keV was strongly suppressed compared with that implanted at 10 keV implantation. The difference in defect distribution between 10 and 3 keV implantation caused the different annealing behavior.
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