Reduction of absorption loss in multicrystalline silicon via combination of mechanical grooving and porous silicon

Abstract

AbstractSurface texturing of silicon wafer is a key step to enhance light absorption and to improve the solar cell performances. While alkaline‐texturing of single crystalline silicon wafers was well established, no efficient chemical solution has been successfully developed for multicrystalline silicon wafers. Thus, the use of alternative new methods for effective texturization of multicrystalline silicon is worth to be investigated. One of the promising texturing techniques of multicrystalline silicon wafers is the use of mechanical grooves. However, most often, physical damages occur during mechanical grooves of the wafer surface, which in turn require an additional step of wet processing‐removal damage. Electrochemical surface treatment seems to be an adequate solution for removing mechanical damage throughout porous silicon formation. The topography of untreated and porous silicon‐treated mechanically textured surface was investigated using scanning electron microscopy (SEM). As a result of the electrochemical surface treatment, the total reflectivity drops to about 5% in the 400‐1000 nm wavelength range and the effective minority carrier diffusion length enhances from 190 µm to about 230 µm (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)