Abstract
The thermal isolation capabilities of fluid cooled via-enhanced glass interposers are investigated with resistive-heater test chips and IR thermography. Previous studies have shown that the degree of thermal coupling between adjacent devices hosted on via-enhanced low conductivity interposers is lower than those on silicon interposers, but at the cost of increased chip-to-ambient thermal resistance. By integrating the enhanced low-k interposer with an embedded microgap cooler, much higher chip power can be dissipated while maintaining an acceptable temperature rise.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
