Abstract
Wettability of solids by liquid metals plays an important role in numerous technological processes. In this work, the effect of a steady magnetic field (SMF) on the wettability of copper and silica substrates by a Ga–In–Sn liquid alloy was investigated using the sessile drop technique. It was found that the contact angles on both substrates increased with increasing SMF intensity. The reduced wettability can be attributed to a change in liquid surface tension under the action of an SMF. In combination with the equations of state, the increase of the contact angle with the SMF intensity is predicted, which is in reasonable agreement with experimental results.
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