Abstract
The effects of a transverse temperature gradient in reversively switched-on dynistors have been studied. Taking into account these effects is important for high-voltage frequency dynistor assemblies because of the problems of a distributed cooling of the devices. A simulation description is given for the spatial dynamics of charges and heat in dynistor chips in switching of repeated current pulses. An estimation method is suggested for calculating the maximum repetition frequency coordinated with the heatsink heatsink cooling power.
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