Recrystallization studies in solid-solution alloys of Cu-Ag-Al

Abstract

The isothermal recrystallization kinetics of rolled Cu-Ag alloys containing up to 1.2 at.% Al have been followed metallographically and by hardness measurements and the nucleation rates measured by X-ray back-reflection techniques. Electron-microscopic studies have been carried out to characterize the as-deformed structures and the structural changes occurring during the annealing process. The recrystallization of the alloys was retarded as the aluminium content increased. Nucleation occurred both in the bulk and along the existing grain boundaries and the rates of nucleation varied with time. These effects have been found to be dependent on the deformation structure, alloy composition and the temperature of anneal. The process of grain-boundary migration during recrystallization was very anisotropic and this has been shown to be caused primarily by the nature of the deformation structure.