Recrystallization of cold rolled oxide dispersion strengthened copper during room temperature annealing

Abstract

Static discontinuous recrystallization was studied during room temperature annealing of a newly designed 80% room temperature rolled oxide dispersion strengthened copper. At early stages of annealing, fine new oriented nanosized/submicron grains were recrystallized in the unique matrix of single brass-oriented deformed grain. Upon longer annealing time up to 14 months, the size, area fraction and number density of the recrystallized grains increased significantly along with changing the crystallographic textures. The analysis of misorientation angle distribution of boundaries indicated transformation of low angle boundaries to high angle boundaries results in nucleation of recrystallized grains by significant contribution of static recovery. Furthermore, the constant level of mechanical hardness after recrystallization was interpreted by the balance between grain size hardening, oxide particle hardening and strain hardening.