Recrystallization and grain growth in Ni 3Al with and without boron

Abstract

The recrystallization and grain growth of boron-free and boron-doped (500 ppm by weight) Ni 3Al polycrystals were investigated in the temperature range 700–1000°C. The levels of deformation were 17% reduction in length in compression for both alloys and 40% rolling reduction applied only to the boron-doped alloy. For alloys with or without boron, the Kolmogorov-Johnson-Mehl-Avrami relationship holds, with the Avrami exponent near unity, and the recrystallization rate is very slow. The activation energies for recrystallization are respectively 480 and 492 kJ/mol for boron-free and boron-doped to 40%. The grain growth kinetics obey a power law with the time exponent ranging from 0·2 to 0·4. The boron effect at 500 ppm was found to be small on both recrystallization and grain growth in Ni 3Al.