Abstract
The interest for the ionic liquids, which are environmentally friendly, is increasing day by day because of their high performance in recovery of metals. In this work, 1-ethyl-3methyl-imidazolium hydrogen sulfate ([Emim]HSO4) ionic liquid and its aqueous solutions were used as leaching media for dissolution of waste printed circuit boards (WPCBs) to recover of copper in the presence of hydrogen peroxide (H2O2) as oxidant. The effects of ionic liquid concentration, leaching time and temperature on the copper recovery rate were investigated. By the way dissolution behavior of iron was also determined. Leaching temperatures were selected as 25°C and 50°C. The results showed that recovery rates of copper and iron decreased with increasing ionic liquid concentration. Leaching time and temperature had positive effect on copper and iron dissolution. Higher dissolution rates were obtained with heat treated samples than not heat treated samples.
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