Recovery of copper from electroplating sludge using integrated bipolar membrane electrodialysis and electrodeposition

Abstract

Electroplating sludge, though a hazardous waste, is a valuable resource as it contains a large amount of precious metals. In this study, copper was recovered from the electroplating sludge using a technology that integrates bipolar membrane electrodialysis (BMED) and electrodeposition. The experimental results showed that Cu2+ in the electroplating sludge was successfully separated and concentrated in the BMED system without adding any chemical reagents; the concentrated Cu2+ was recovered in the form of copper foil in an electrodeposition system. Current density clearly affected the Cu2+ separation and concentration in the BMED system; the current density, solution pH and Cu2+ concentration drastically affected the Cu2+ electrodeposition ratio and the morphology and purity of the obtained copper foil. Under the optimised experimental conditions, 96.4% of Cu2+ was removed from the electroplating sludge and 65.4% of Cu2+ was recovered in the foil form. On increasing the number of electroplating sludge compartments from one to two and three, the current efficiency for recovering Cu2+ increased from 17.4% to 28.5% and 35.2%, respectively, and the specific energy consumption decreased from 11.3 to 6.7 and 5.3 kW h/kg of copper, respectively. The purity of the copper foil was higher than 99.5%. Thus, the integrated technology can be regarded as an effective method for recovering copper from electroplating sludge.