Recovery by triple junction motion in aluminium deformed to ultrahigh strains

Abstract

Commercial purity aluminium at true strains ε =2∼5.5 was annealed in a wide temperature range (from room temperature to 220°C), and the evolution of microstructure was characterized using transmission electron microscopy (TEM) and electron backscattered diffraction (EBSD) techniques. Triple junctions in an ultrafine lamellar structure are classified into three categories based on the structural morphology, and a relationship is formulated between the density (length per unit volume) of triple junctions and the boundary spacing. The triple junction density increases with increasing strain during plastic deformation and decreases during isochronal and isothermal annealing. Based on TEM and EBSD observations, thermally activated triple junction motion is identified as the key process during the recovery of highly strained aluminium, leading to the removal of thin lamellae with small dihedral angles at the ends and structural coarsening. A mechanism for recovery by triple junction motion is proposed, which can underpin the general observation that a lamellar structure formed by plastic deformation during annealing can evolve into an equiaxed structure, preceding further structural coarsening and recrystallization. Within this framework, the grain boundary surface tension on triple junctions is discussed based on the structural parameters characterizing the deformed and annealed microstructure.