Abstract
The electrolyte composition effect on the microhardness of bright copper coatings electrodeposited from sulphuric acid electrolytes was established. It is shown that the sulphuric acid content and the type of brightener agent strongly influence the rate of decrease of microhardness of deposited coatings with time. The systematic quantitative and qualitative investigations performedin situ determined the microhardness changes on the one hand, and the change in microdeformations, dislocation defects, crystallites size and texture of copper coatings on the other hand, thus demonstrating unambiguously the correlation betweeen them. The decrease in copper coating microhardness is explained by the occurrence of recovery and recrystallization processes at room temperature.
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