Abstract

We analyze the recombination properties of passivating electron selective contacts based on nanostructured silicon oxide. Our contact design is based on an interfacial buffer oxide capped with a bilayer structure of phosphorus-doped silicon oxide and silicon which is annealed at 900 °C. We investigate in detail the effects of the initial dopant concentration in the bilayer and of the anneal dwell time on dopant in-diffusion, contact formation, and interface recombination. Our investigation addresses also the hydrogenation of interface defects and the effect of indium-tin-oxide (ITO) sputtering, allowing us to separate the interplay between enhanced field-effect passivation, Auger recombination, and interface recombination. After thermal annealing, the passivating electron selective contact presented here attains a saturation current density ( J 0) of 12.4 fA cm −2 for medium doping, which improves further upon hydrogenation to J 0 = 8.1 fA cm−2. For specific contact resistances <500 mΩ cm 2, however, higher doping concentrations are required. For those doping concentrations, the saturation current density is 13.9 fA cm−2 and increases by 10% upon sputter-deposition of an ITO layer on top of the electron selective stack.

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