Abstract

Recognition and Visualization of Lithography Defects based on Transfer Learning

Highlights

  • Defect reduction is critical during the integrated circuit (IC) manufacturing process

  • Grad-CAM can realize the autonomous location of defects, which is of great significance for improving the automatic control system of integrated circuit manufacturing

  • We first demonstrated the recognition and classification of several lithography defects based on transfer learning

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Summary

Introduction

Defect reduction is critical during the integrated circuit (IC) manufacturing process. Through the continuous shrinking of the process, the defect control is becoming more and more stringent, which prompt engineers to use low-magnification and large field of view electronic scanning technology, and perform rapid comparison through spatial feature analysis [2]. The limitation of this method is that the types of defect cannot be automatically classified, and the size of the identifiable defect be greatly restricted. This method will be used to improve the existing defect detection system in the field of IC manufacturing and improve the efficiency of autonomous identification

Method
Identification Algorithm
The Structure and Working Principle of the Fine-Tuned Neural Network
Trainable Properties of the Fine-tuned Model
Optimization Algorithm of Neural Network
Visualization Algorithm
Visualizing the Intermediate Activation
Grad-CAM
Experiment and Result Discussion
Data Preprocessing
Visualize Intermediate Activation
Defect Location
Findings
Conclusion
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