Abstract
Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.
Highlights
Due to rapid progress in power electronics and packaging devices, there is a strong demand for better joining materials and processes
A method designed to improve the shortcomings of solid phase diffusion bonding is a liquid phase diffusion (TLP) bonding method
In modern power electronics devices, transient liquid phase (TLP) bonding has become become a potential candidate for joining direct bonded copper (DBC) to semiconductor chips
Summary
Due to rapid progress in power electronics and packaging devices, there is a strong demand for better joining materials and processes. The IGBT module is generally encapsulated with multiple diodes, metal-oxide field-effect transistors (MOSFETs), and intelligent power modules (IPMs) for the surface protection of wire bonds from the external atmosphere These power semiconductors are generally bonded with a die attach material or soldered to the DBC substrate for electrical and thermal contact and insulation when necessary. These alloysTherefore, are still atin the beginning stage in the intend to review the details of recent research trends in TLP bonding and wire bonding, which field of microjoining [26]. Sn-based solders for TLP bonding compared to expensive Ag-based die-attached materials
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