Abstract
This paper highlights key recent advances in the infrastructure of Milli-Meter Wave (MMW) technology. They include improved MMIC design methodologies, enhanced HEMT and HBT wafer processes, new on-wafer testing capabilities, automated assembly of MMW Multi-Chip Assemblies (MCAs) and new packaging techniques. It also addresses the implications of these advances in terms of their impact on a wide range of military and commercial systems. The paper concludes with comments on future trends and directions of the MMW technology.
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