Abstract
Abstract Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Applications for Advanced Packaging; Global AI Computing Hardware Total Available Market (TAM); Die partitions; Defect Density; FC-BGA Families Trends; Technical Challenges of CUF; Underfills for Advanced Packaging; Severe KOZ on MCM; Bleed Out; Formulation Technique; Concerns during penetration; Chip package interaction (CPI) Challenges; and summary.
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