Abstract
This paper reviews the major researchers of liquid, immersion, and two-phase cooling. Currently, liquids are used instead of air to cool the growing data centers. Immersion cooling shows a higher heat transfer coefficient than conventional cooling (<37 W/cm2). Because the use of liquids with high global warming potentials is prohibited, the number of liquids that can be used is limited. This paper discusses the existing, relevant literature from researchers who have studied the issue at least thrice. The authors were divided into those who focused on the surface and those who formed a structure on the surface. In summary, the authors suggested the following research directions: The experimental conditions of porous foam are not diverse, and there is a concern about the separation of foam and coating into the tub. The experimental conditions of the immersion tub should also be varied according to the heat and pressure over time. Structure-level research shows higher performance than surface-level research, but an economic feasibility study is required.
Highlights
Modifications for ThermalIndustrial Revolution 4.0, as well as the development of related industries, such as autonomous driving vehicles, cloud computing, artificial intelligence, and big data technology have caused the IT sector to consume approximately 10% of the world’s energy in 2020 and is expected to consume 20% by 2030 [1]
The performance of the data center is expressed in terms of power usage effectiveness (PUE), which is the ratio of the total energy usage to the actual computing energy
This study focuses on pool boiling without additional driving force to enhance heat dissipation, liquidbased two-phase immersion cooling for data centers
Summary
Industrial Revolution 4.0, as well as the development of related industries, such as autonomous driving vehicles, cloud computing, artificial intelligence, and big data technology have caused the IT sector to consume approximately 10% of the world’s energy in 2020 and is expected to consume 20% by 2030 [1]. The thermal issues in the data center over the past decades have been addressed by air-cooling methods, the technical limitations of air cooling (37 W/cm2 ) are yet to be addressed [3] owing to the dense and high-performance computing. Liquid cooling technologies have been adopted as an efficient thermal management strategy for various electronic components as well as for data center cooling. Fluorocarbon-based liquids are in disfavor owing to their high GWP, two-phase immersion cooling studies have often been conducted with fluorocarbons, such as FC-72 and PF-5060. Another consideration is the boiling point of cooling liquids.
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