Abstract
Ever-increasing performance and functions of electronic systems are pushing the requirements for heat dissipation of devices at an unprecedented pace. To package individual devices (especially those working in high-power mode), research and development of thermal interface materials (TIMs) have accelerated since the beginning of this century. Thermal conduction, mechanical performance, and electrical insulation are the general specifications of interest besides their durability and reliability in developing TIMs. Mechanical performance is crucial in reducing the thermal interface resistance (TIR) between TIM and its bridged surfaces, i.e., between the device and the heat sink. To fill the gaps formed by the hard surfaces for reducing the TIR, TIMs should be “soft” enough upon external pressures. Nevertheless, depending on practical applications, the selection of TIM might release some specifications to guarantee the others. This review summarizes the latest developments of TIMs, addresses their processing methods and heat dissipation performance, highlights their remaining issues, and provides a perspective on their future development.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: World Scientific Annual Review of Functional Materials
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
