Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics

Abstract

Mechanisms, materials, and processes of high-resolution printing techniques dedicated to printed electronics are reviewed. Advanced printing methods, including reverse offset printing and adhesion contrast planography, use absorption of ink solvents by polydimethylsiloxane (PDMS) to semi-solidify inks before ink-transfer. The patterning principle transforms from wetting to adhesion and fracture; resolution problems encountered during the patterning of liquid inks (e.g. spreading, splitting, coalescence, bulges, and coffee ring shapes) can be avoided, and single-μm features can be achieved. After summarizing the fundamentals of reverse offset printing, details on the patterning mechanism and contact mechanics encountered during the process are shown together with the design concept of the ink formulation. Complementary processes for multilayered electronic devices (e.g. wet-on-wet for high-throughput production, buried electrode formation, taper formation, and vertical interconnections) and the prediction of pattern size integrity are presented.