Abstract
This paper reports on recent progress in infrared detection modules that integrate infrared photodetectors, signal processing electronics, optics, heat dissipation systems, and other components in common packages. The integration makes detectors less vulnerable to over-bias, electrostatic discharges, electromagnetic interferences, and other environmental exposures. Additional advantages of integration are improved HF performance, output signal standardization, miniaturization, and cost reduction. Examples are given of detection modules with an infrared detector optimized for uncooled or Peltier-cooled operation in the spectral range of 2 to 16 μm. The paper is mainly based on the authors’ experience in the development and fabrication of detection modules at Vigo System S.A.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
