Abstract
The boosting of consumer electronics and 5G technology cause the continuous increment of the power density of electronic devices and lead to inevitable overheating problems, which reduces the operation efficiency and shortens the service life of electronic devices. Therefore, it is the primary task and a prerequisite to explore innovative material for meeting the requirement of high heat dissipation performance. In comparison with traditional thermal management material (e.g., ceramics and metals), the polymer-based thermal management material exhibit excellent mechanical, electrical insulation, chemical resistance and processing properties, and therefore is considered to be the most promising candidate to solve the heat dissipation problem. In this review, we summarized the recent advances of two typical polymer-based thermal management material including thermal-conduction thermal management material and thermal-storage thermal management material. Furtherly, the structural design, processing strategies and typical applications for two polymer-based thermal management materials were discussed. Finally, we proposed the challenges and prospects of the polymer-based thermal management material. This work presents new perspectives to develop advanced processing approaches and construction high-performance polymer-based thermal management material.
Highlights
With the innovation of the electronics industry and the development of 5G technology, electronic devices tend to be miniaturized, highly integrated, and multi-functional
Because the crystallinity of most polymers is less than 100%, there will inevitably be an interface between crystal and amorphous region, which will lead to phonon scattering and reduce the thermal conductivity
The results indicated that the loading content of polyethylene glycol (PEG) is as high as 96.6%, much higher than that prepared by hydrothermal reduction method, and because of the encapsulation effect of rGO aerogel, there is no leakage of liquid in PEG/rGO composites, displaying good shape stability
Summary
With the innovation of the electronics industry and the development of 5G technology, electronic devices tend to be miniaturized, highly integrated, and multi-functional. To improve the working performance and the lifetime of electronic devices, developing thermal management material with efficient heat dissipation capabilities is necessary. The intrinsic thermally conductive polymers feature special phonon transfer structure; the thermally conductive polymer composites contain various thermally conductive fillers, they exhibit high thermal conductivity that can be used to quickly conduct excess heat of electronic devices to the surrounding environment, and they are commonly used thermal-conduction thermal management material [6,7]. Due to its high energy-storage density and thermal conductivity, PCM are considered to be a promising candidate for the preparation of thermal-storage thermal management material [10,11]. We reviewed the two important types of polymer-based thermal management material reported in recent years (Figure 1). The structure design and processing strategy for the preparation of thermal-storage polymer-based thermal management material with high energy-storage density and fast thermal response rate were summarized. The challenges and prospects of the polymer-based thermal management material were proposed
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