Abstract
This work studies the performance of commercially available Al pastes for the rear side contact formation with an industrially feasible process. The pastes are specifically designed for local Al-BSF/PERC (Passivated emitter and rear cell) cells. With this type of metallization, fill factors (FF) up to 80% are demonstrated, to our knowledge, the highest FF ever reported on fully screen printed PERC cells with industrial type emitter. Additionally, the use of an AlSi eutectic (12.7% Si) target for PVD sputtering is evaluated in comparison to a reference process using a pure Al target with the same kind of deposition technique. It was found that the thickness of the Al p+ BSF layer realized with the 12.7% Si containing Al target is systematically thicker than the reference due to a smaller metal Si interface. With this method, solar cells have been fabricated showing a potential efficiency above 20%, with standard Ag front screen printing on 60 Ω/□ emitter.
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