Realizing Mechanically Robust and Electrically Conductive Wood via Vacuum Pressure Impregnation.

Abstract

Wood is highly regarded as the most sustainable resource that is widely used in structural applications. To extend its practicality in electrically conductive applications, it is necessary to confer electrical conductivity to the insulating wood. The most common strategy is to derive carbonized wood powder via an annealing process. Even though these carbonized wood powders are electrically conductive, they lost the ancestry characteristic of wood, that is, excellent mechanical properties. As such, it is of great importance to realize the concept of conductive wood while at the same time maintaining or even enhancing its mechanical properties further. By leveraging on the naturally formed transportation channels found in trees, conductive particles can be aligned along these ordered channels. To substitute active transport in living plants, a vacuum pressure impregnation process was used to infiltrate these conductive particles into the transportation channels. As a result, Cu/wood composite, denoted as Cu-SW, exhibited a minimum volume resistivity of 1.366 × 103 Ω cm, which was lower than those of conventional semiconductors. High Cu loading of ∼43.1 volume % of the final product, Cu-SW, was achieved with such technique, which clearly indicates the ability to achieve deep penetration of Cu nanoparticles into the bulk wood. Furthermore, an encouraging mechanical properties improvement of ∼50% was recorded for Cu-SW as compared to the wood matrix. With the enhancement in both conductivity and mechanical properties, Cu-SW could be used in load-bearing application that requires electrical conduction.