Abstract
We show a technology to overcome a known bottleneck in the communication between processor and memory or, especially in multiprocessor systems, among the processors themselves. The solution is communication with the help of fiber bundles with defined pitch. The disadvantages of microstructures based on poly-methyl-meth-acrylate are described. Attractive alternatives based on silicon for precisely structured elements are explained. A practical example of a fiber array is visualized.
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