Abstract
The conventional chip-on-board light-emitting diodes (COB-LEDs) with flat encapsulant layer present low light efficiency due to the total internal reflection (TIR) happens at the encapsulant-air interface. In this study, microlens array was realized on the flat encapsulant layer of COB-LEDs to diminish the TIR at the encapsulant-air interface. The microlens array was fabricated by selectively exposing the UV glue film in UV-light through a pre-designed photomask. Micro-pillars form after the UV-light exposure and microlens array forms spontaneously due to the wetting process of uncured UV glue on the micropillars. The geometry of the microlens array was experimentally optimized, and the light efficiency enhancement of COB-LEDs by the microlens array was analyzed. The results show that optimal geometry of microlens array with curvature of ~41° and base diameter of ~87 μm can be realized by adjusting the UV-light exposure time as >40 s and UV glue film thickness as >80 μm. Compared to the traditional flat encapsulant layer, the microlens array with optimal geometry increases the light efficiency of blue and ~5000 K white COB-LEDs by 50.9% and 9.31%.
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