Abstract
This paper demonstrates how recent progress for real-time solidification observation at SPring-8 synchrotron has contributed to the development of Sn-7wt%Cu-0.05wt%Ni high temperature lead-free solder alloys. Lead-free solder alloys in the composition range Sn-0.7 to 7.6wt%Cu that consist of primary Cu6Sn5in a eutectic Sn-Cu6Sn5matrix have been proposed as solders for application at temperatures up to 400°C for the assembly high current semiconductors. It is shown that trace levels of Al have a marked effect on the solder microstructure and refine the size of the primary Cu6Sn5. The solidification pathway that leads to the refinement was observed in real-time using X-ray synchrotron observations.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
